
(MEMBER OF THE T-ESC® FAMILY)
Glassfiber T-ESC®
The Glassfiber Transfer ElectroStatic Carrier (Glassfiber T-ESC®) enables temporary bonded wafer thinning without the need of adhesive, starting from a thick wafer grinding down to ultra thin wafer thickness. This mobile rigid wafer support helps to generate high yield even when going to the ultra thin wafer thicknesses. Furthermore this mobile electrostatic Carrier can be used in process applications such as handling and probing.
Glassfiber T-ESC®
Typical Applications
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Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors, etc.)
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High flatness
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Re-usable
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Sizes from 2" to 12", customized shapes and features possible
Recommended Processes:
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Grinding
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Handling
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Probing

Grinding
Grinding is a substrate thinning process, where material is mechanically removed.
Our Machines

ACU 3000
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.
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MCU 3000
A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.
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