Handling

Probing

Spin Etching

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

(Single Wafer) Spin Etching

Slide-Off De-Bonding

Handling

Electro Plating

Annealing

DIE Handling

Handling

Ion Implantation

CVD/PECVD

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Electro Plating

Handling

Handling

Optical Bonding

Substrate Bending

Handling

PVD/Sputter

PECVD

OVPD

CVD

Plasma Cleaning / Ashing

Handling

PVD/Sputter

PECVD

OVPD

CVD

Plasma Cleaning / Ashing

Grinding

Handling

Probing

Our Machines

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

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MCU 3000 freigestellt

MCU 3000

A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.

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