The Transfer ElectroStatic Carrier (T-ESC) Technology is already known as a fast and reliable temporary bonding technique for handling and processing of thin and ultra-thin wafers. Clamping forces can be achieved within seconds. The reversible charging process guarantees quick fixing and quick release without organic residues.
To achieve higher flexibility in terms of charging and discharging, ProTec developed an additional method of electrical contacting of the wafer-carrier package from the backside. Another benefit of this charging method is that there is no need of touching the front side anywhere.