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All of these three technologies have their specific pros and cons:
1. Glue type of bonding is comparatively expensive and can lead to problems when the package of wafer and carrier is exposed to high temperatures. Besides that it can be used in more or less all process steps.
2. TAIKO process is a special grinding method to keep the wafer mechanically stable even with reduced thickness in the center. It is cost effective as grinding is needed in general in wafer thinning, but the technology is not applicable for all types of semicon processing and each substrate.
3. Mobile electrostatic carrier is a cost effective method to hold most existing wafer materials also in High Temperature without issues in terms of contamination. Also cleaning steps after de-bonding are avoided. The throughput is comparable high. Full Immersion type of processes, where the complete carrier is in contact with liquid, are still challenging for the technology. The bonding force is compared to glue type far lower.
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