Handling
Spin Etching
Probing
(Single Wafer) Spin Etching
Handling
Lithography
Spin Coating
EBR
Baking
Exposure
Resist Developing
Resist Stripping
Slide-Off De-Bonding
Handling
Electro Plating
Annealing
DIE Handling
Electro Plating
Handling
Ion Implantation
CVD/PECVD
PVD/Sputter
Plasma Clean / Ashing
DRIE / RIE
Optical Bonding
Handling
Substrate Bending
Handling
PVD/Sputter
PECVD
OVPD
CVD
Plasma Cleaning / Ashing
Handling
PECVD
OVPD
CVD
Plasma Cleaning / Ashing
PVD/Sputter
Grinding
Handling
Probing
Our Machines
ACU 3000
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.
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MCU 3000
A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.
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