Protec
Display / Glass
back to the overview
Polymer T-ESC®
Handling
Spin Etching
Probing
Litho HT T-ESC®
(Single Wafer) Spin Etching
Handling
Lithography
Spin Coating
EBR
Baking
Exposure
Resist Developing
Resist Stripping
Slide-Off De-Bonding
HT T-ESC®
Handling
Electro Plating
Annealing
DIE Handling
MCU 3000
Available in three basic sizes:
4”/6”, 6”/8”, and 8”/12”,
Weight:
20 kg
Process Media:
Power supply
N2 (CDA/compressed air),
Vacuum
Machine Dimensions:
L x W x H:
621 x 430 x 330 mm
ACU 3000
Weight:
1000 kg
Process Media:
Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum
Communication:
SEMI Standard SECS/GEM
other on request
Machine Dimensions:
L x W x H: 1440 x 1485 x 2092 mm
Weight:
1000 kg
Clean Room Class: 100, 10
PR HT T-ESC®
Electro Plating
Handling
Ion Implantation
CVD/PECVD
PVD/Sputter
Plasma Clean / Ashing
DRIE / RIE
Polymer electrostatic chuck and Polymer T-ESC®
Optical Bonding
Handling
Substrate Bending
High Temperature ElectroStatic Chuck and HT T-ESC®
Handling
PVD/Sputter
PECVD
OVPD
CVD
Plasma Cleaning / Ashing
Ceramic electrostatic chuck and High Temperature T-ESC®
Handling
PECVD
OVPD
CVD
Plasma Cleaning / Ashing
PVD/Sputter
Racket bipolar
Optional Media:
N2 or CDA, Vacuum
Process Media:
Power supply 9V battery
Sizes:
4”, 6”, 8”, 12”, other shapes on request
Measurement Controller
Stationary power supply - Adjustable voltage range:
± 2 kV, ± 3 kV, 0 to 3 kV
others on request
Battery powered - Adjustable voltage range:
± 2 kV, others on request
Glass fiber T-ESC®
Grinding
Handling
Probing
<p>Our Machines</p>
ACU 3000
A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.
Learn MoreMeasurement Controller
ProTec® offers a wide range of High Voltage power supplies, our High Voltage Measurement Controllers (HV MC) for dedicated chucking tasks.
Learn More