Polymer T-ESC®

Handling

Spin Etching

Probing

Litho HT T-ESC®

(Single Wafer) Spin Etching

Handling

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

Slide-Off De-Bonding

HT T-ESC®

Handling

Electro Plating

Annealing

DIE Handling

MCU 3000

Available in three basic sizes:

4”/6”, 6”/8”, and 8”/12”,

Weight:

20 kg

Process Media:

Power supply
N2 (CDA/compressed air),
Vacuum

Machine Dimensions:

L x W x H:
621 x 430 x 330 mm

ACU 3000

Weight:

1000 kg

Process Media:

Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum

Communication:

SEMI Standard SECS/GEM
other on request

Machine Dimensions:

L x W x H: 1440 x 1485 x 2092 mm

Weight:

1000 kg

Clean Room Class: 100, 10

PR HT T-ESC®

Electro Plating

Handling

Ion Implantation

CVD/PECVD

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Polymer electrostatic chuck and Polymer T-ESC®

Optical Bonding

Handling

Substrate Bending

High Temperature ElectroStatic Chuck and HT T-ESC®

Handling

PVD/Sputter

PECVD

OVPD

CVD

Plasma Cleaning / Ashing

Ceramic electrostatic chuck and High Temperature T-ESC®

Handling

PECVD

OVPD

CVD

Plasma Cleaning / Ashing

PVD/Sputter

Racket bipolar

Optional Media:

N2 or CDA, Vacuum

Process Media:

Power supply 9V battery

Sizes:

4”, 6”, 8”, 12”, other shapes on request

Measurement Controller

Stationary power supply - Adjustable voltage range:

± 2 kV, ± 3 kV, 0 to 3 kV
others on request

Battery powered - Adjustable voltage range:

± 2 kV, others on request

Glass fiber T-ESC®

Grinding

Handling

Probing

<p>Our Machines</p>

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

Learn More

Measurement Controller

ProTec® offers a wide range of High Voltage power supplies, our High Voltage Measurement Controllers (HV MC) for dedicated chucking tasks.

Learn More