Spin Etch Carrier

(MEMBER OF THE T-ESC® FAMILY)

Polymer T-ESC®

The Polymer Transfer ElectroStatic Carrier (Polymer T-ESC®) is a low cost Carrier solution for processes without high heat impact where only handling is in focus. Additionally it can be used for wafer flipping applications.

As an option there is a modified version of this mobile electrostatic carrier which is suited for spin etching in SEZ-Tools with Bernoulli Chucks. The special shape of the Polymer T-ESC® enables carrying a thin substrate through the process without creating residuals between carrier and thin wafer during the etching process.

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Polymer T-ESC®

Typical Applications

  • Compatibility with existing handling systems (transport cassettes, vacuum, Bernoulli or mechanical end effectors, etc.)
  • High flatness
  • Re-usable
  • Sizes from 2" to 12", customized shapes and features possible

Recommended Processes

  • Handling
  • Probing
  • Spin Etching

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Polymer Transfer ElectroStatic Carrier (T-ESC) Technology

Handling

During Wafer processing the wafer needs to be transferred back and forth from cassettes to tools and also inside the tools from on station to the other. For fragile substrates this is already challenging, because they tend do brake or get cracks, which can lead to future breakage.  Also bowing of thinned substrates brings a lot of trouble for all tooling because they are usually not designed for this very special operation. Temporary bonding with our T-ESC® is a great help here as the processing tools only see a standard wafer and trouble with handling, therefore wafer breakage is eliminated.

Probing

Various probing methods exist, they are used to check the substrate´s or device´s functionality, e.g. there are optical inspection or electrical probing.

Spin Etching

Spin Etching is following the same principle like spin coating. The substrate is clamped to a chuck and during spinning etching chemicals are jetted to the surface.

Our Machines

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

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MCU 3000 freigestellt

MCU 3000

A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.

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