T-ESC®

Semiconductor

The T-ESC® Technology by ProTec® offers safe and easy handling as well as processing of fragile, thin and ultra-thin substrates (< 50 µm), e.g. GaAs, InP, LN, LT, thin silicon, thin MEMS wafer and many more. The basic concept behind this adhesive free temporary bonding technology involves using electrostatic force to chuck thin and ultra-thin wafers onto mobile rigid Carriers (T-ESC®). Such wafer-Carrier packages can be handled and processed like wafers of standard thickness.

Therefore, existing standard cassettes, handling tools, and fabrication equipment can be used without modifications. Additional effect: the warping and bowing of thin and ultra-thin substrates are eliminated, which is highly welcome. All our Carriers are available in standard sizes from 2" to 12" and additionally in customized shapes suited to the intended application.

Grinding

Handling

Probing

Electro Plating

Annealing

DIE Handling

Handling

Lithography

Spin Coating

EBR

Baking

Exposure

Resist Developing

Resist Stripping

(Single Wafer) Spin Etching

Slide-Off De-Bonding

Handling

Handling

Probing

Spin Etching

Ion Implantation

CVD/PECVD

PVD/Sputter

Plasma Clean / Ashing

DRIE / RIE

Electro Plating

Handling

Our Machines

Maschine Protec ACU 3000

ACU 3000

A fully automated electrostatic chucking/de-chucking unit with up to 120 wafers and/or T-ESC® packages per hour, guarantying an highest yield during handling and many diagnostics features.

Learn More
MCU 3000 freigestellt

MCU 3000

A manual chucking / de-chucking unit of thin and ultra-thin substrates on carriers T-ESC® for flexible sizes from 4”/6” to 8”/12” with a high flexible mobile handling tool and diagnostic features.

Learn More