Machinery

ACU 3000

ProTec®´s Automated Chucking Unit (ACU 3000) is built for high volume temporary bond and de-bond applications with up to 120 wafer + T-ESC®´s packages per hour. The ACU 3000 is operating fully automated, the cassettes need to be placed inside the cassette tower and the tool starts with the intended bonding/ de-bonding task. Inside the machine Bernoulli end effectors are handling the wafers and T-ESC´s in a safe and reliable way, even 50µm thin wafers can be handled free standing. Also the alignment and fixation during the chucking procedure is done based on the Bernoulli principle, guarantying highest yield during handling. The ACU 3000 comes with even more diagnostic features then the MCU 3000 enabling secure data collection through the entire wafer processing chain.

ACU 3000

Typical Applications

  • Non-contact substrate/wafer handling as per Bernoulli’s principle with high precision alignment for electrostatic Carrier and wafer

  • Thin and ultra-thin substrate/wafer (< 50 µm) handling

  • Throughput of up to 120 carrier packages per hour

  • Two ID readers, reading from back and front side

  • Process Media: Power supply 100–240 V, Pneumatics N2 or CDA, Vacuum

  • Communication: SEMI Standard SECS/GEM, other on request

  • Machine Dimensions: L x W x H: 1440 x 1485 x 2092 mm

  • Weight: 1000 kg

  • Clean Room Class: 100, 10

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Technical Data

Process Media:

Power supply 100–240 V
Pneumatics N2 or CDA
Vacuum

Communication:

SEMI Standard SECS/GEM
other on request

Machine Dimensions:

L x W x H: 1440 x 1485 x 2092 mm

Weight:

1000 kg

Clean Room Class: 100, 10